Packaging technology for semiconductor manufacturing

Electronic packaging is an indispensable process after the production of integrated circuit chips, and it is a bridge from device to system. Packaging, the production link, has a great impact on the quality and competitiveness of microelectronic products. According to the current international opinion, in the overall cost of microelectronic devices, design accounts for one-third, chip production accounts for one-third, and packaging and testing also account for one-third. There is one in the world.

The global development of packaging research is so rapid, and the challenges and opportunities it faces have never been encountered since the advent of electronic products; the wide range of problems involved in packaging are also rare in many other fields. It is a highly comprehensive new high-tech discipline ranging from materials to technology, from inorganic to polymer, from large-scale production equipment to computational mechanics.

What is encapsulation

The original definition of packaging is to protect the circuit chip from the surrounding environment (including physical and chemical influences).

Chip packaging is the use of (film technology) and (microfabrication technology) to arrange, paste, fix and connect chips and other elements on the frame or substrate, lead out the terminals and potting and fixing them with a plastic insulating medium to form an overall structure.

Electronic packaging engineering is to connect and assemble elements such as substrates, chip packages, and discrete devices according to the requirements of the electronic complete machine to achieve certain electrical and physical properties, and transform them into complete machine or system form equipment or equipment.

Integrated circuit packaging can protect the chip from or less affected by the external environment, and provide it with a good working condition, so that the integrated circuit has a stable and normal function.

Chip packaging can realize power distribution; signal distribution; heat dissipation channels; mechanical support; and environmental protection.

The level of packaging technology:

The first level, also known as chip level packaging, refers to the process of pasting and fixing circuit wiring and packaging protection between the integrated circuit chip and the packaging substrate or lead frame, making it easy to pick and place and transport, and can be combined with The next level of assembly is to connect the modular components.

The second level is the process of combining several packages completed at the first level with other electronic components to form an electronic card.

The third level is the process of combining several circuit cards composed of packages completed at the second level into a main circuit board to make it a component or sub-system.

The fourth level is the process of assembling several subsystems into a complete electronic factory.

They are chip interconnect level (zero-level packaging), first-level packaging (multi-chip components), second-level packaging (PWB or card) and third-level packaging (mother board).

Package classification

According to the number of integrated integrated circuit chips in the package, chip packaging can be divided into two categories: single-chip packaging and multi-chip packaging;

According to the sealing materials, it can be divided into polymer materials and ceramics;

According to the interconnection method of the device and the circuit board, the package can be divided into two categories: pin insertion type and surface mount type;

According to the pin distribution, there are four types of package components: single-sided pins, double-sided pins, four-sided pins, and bottom pins.

Common single-sided pins are single-row package and cross-pin package;

Bilateral pin components have dual-row package miniaturization package;

Quad flat package with four-sided pins;

The bottom pins are available in metal can type and dot array type packages.

Encapsulated term explanation

SIP: Single inline package SQP: Miniaturized package MCP: Metal can package

DIP: Dual-in-line package CSP: Chip size package QFP: Quad flat package

PGA: Dot matrix package BGA: Ball grid array package LCCC: Leadless ceramic chip carrier

The development stage of packaging technology